Flexible Multilayer Designs Provide Cost Effective Packaging Solutions

Paper #:
  • 1999-01-0162

Published:
  • 1999-03-01
Citation:
DiPalermo, J., "Flexible Multilayer Designs Provide Cost Effective Packaging Solutions," SAE Technical Paper 1999-01-0162, 1999, https://doi.org/10.4271/1999-01-0162.
Author(s):
Pages:
6
Abstract:
This paper discusses a variety of manufacturing techniques which have been developed to produce cost effective multilayer interconnects while overcoming the harsh environmental conditions imposed by the Automotive Industry. A comparison is made to the transition of Military Rigid-flex technology and materials needed to overcome the aerospace environment.
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