A Resonating Comb/Ring Angular Rate Sensor Vacuum Packaged Via Wafer Bonding 1999-01-1043
The best features of a comb and ring device have been combined to provide an improved micromachined angular rate sensor. The use of differential combs attached to a centrally supported ring gives this electroformed surface micromachine improved signal output and temperature performance. Previous results have been reported for vibratory ring sensors vacuum packaged in solder sealed CERDIPs. Bulk silicon etching and wafer to wafer bonding, used to fabricate millions of pressure sensors and accelerometers each year, have been employed to vacuum package this new CMOS integrated micromachine. Wafer level packaging allows for MEMS chip-scale packaging at the board level. The goal of this project is to develop a low cost sensor capable of reliably functioning at temperatures between -40 °C and 85 °C. The design, modeling, process, package, performance and automotive applications of this sensor will be covered.
Citation: Zarabadi, S., Vas, T., Sparks, D., Johnson, J. et al., "A Resonating Comb/Ring Angular Rate Sensor Vacuum Packaged Via Wafer Bonding," SAE Technical Paper 1999-01-1043, 1999, https://doi.org/10.4271/1999-01-1043. Download Citation
Author(s):
S. Zarabadi, T. Vas, D. Sparks, J. Johnson, Q. Jiang, M. Chia, E. Borzabadi
Affiliated:
Delphi Delco Electronics Systems
Pages: 7
Event:
International Congress & Exposition
ISSN:
0148-7191
e-ISSN:
2688-3627
Also in:
Sensors and Actuators 1999-SP-1443, Sensors and Transducers, Second Edition-PT-105, SAE 1999 Transactions - Journal of Passenger Cars-V108-6
Related Topics:
Packaging
Microelectromechanical devices
Sensors and actuators
Logistics
Fabrication
Vacuum
Pressure
Joining
Simulation and modeling
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