The Evolution of Microchannel Heat Transfer

Paper #:
  • 1999-01-1357

Published:
  • 1999-04-06
Citation:
Cole, G. and Scaringe, R., "The Evolution of Microchannel Heat Transfer," SAE Technical Paper 1999-01-1357, 1999, https://doi.org/10.4271/1999-01-1357.
Pages:
7
Abstract:
High-density electronics packaging requires new advancement in thermal management. New efforts to standardize three-dimensional electronics packages provide the opportunity to standardize thermal management systems for the first time. Microchannel cooling, a high heat flux technology, is the leading candidate for standardization of earth- and space- based electronics packages. This paper looks at the developments in microchannel cooling that make it more advantageous than other high heat flux techniques and the work that remains to achieve a standardized thermal management system.
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