Micromachined Heat Sinks

Paper #:
  • 1999-01-1408

Published:
  • 1999-04-06
Citation:
Bang, C., Pan, T., and Hyman, D., "Micromachined Heat Sinks," SAE Technical Paper 1999-01-1408, 1999, https://doi.org/10.4271/1999-01-1408.
Pages:
7
Abstract:
A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network that enhances cooling efficiency and minimizes the pressure drop across the device. Experimental test results are presented. Tests to date indicate that up to 76.5 W/cm2 may be removed by the heat sink based on a 100°C electronic device temperature.
Access
Now
SAE MOBILUS Subscriber? You may already have access.
Buy
Select
Price
List
Download
$27.00
Mail
$27.00
Members save up to 40% off list price.
Share
HTML for Linking to Page
Page URL

Related Items

Training / Education
2017-10-27
Training / Education
2013-04-09
Training / Education
2017-01-20
Training / Education
2016-04-30
Technical Paper / Journal Article
2011-04-12
Technical Paper / Journal Article
2011-04-12
Technical Paper / Journal Article
2011-04-12