New Process of Copper Based Conductor for Power Device

Paper #:
  • 2000-01-0136

Published:
  • 2000-03-06
Citation:
Sasaki, Y., Terao, S., Nakagawa, S., and Kaji, M., "New Process of Copper Based Conductor for Power Device," SAE Technical Paper 2000-01-0136, 2000, https://doi.org/10.4271/2000-01-0136.
Pages:
7
Abstract:
A new process for a highly reliable ceramic substrate with electric circuit has been developed for power devices of automotive applications. The circuit conductor has high conductivity to accept a current of 10 to 200 Amperes, and has strong joining strength to ceramic substrates. The conductor is made of sintered copper powders with several kinds of diameters to get a porous structure, for reducing Young's modulus and thermal stress between the circuit conductor and ceramic substrate. Sintering shrinkage of the circuit conductor has been restrained, and joining strength to the ceramic substrates kept strong by an anchor effect. The copper circuit conductor realized electric resistivity of 2.3×10-6 ohm-cm, and coefficient of thermal conductivity, 290 W/mK. We have also confirmed superior reliabilities in the joining strength and conductivity by thermal cycling tests.
Access
Now
SAE MOBILUS Subscriber? You may already have access.
Buy
Select
Price
List
Download
$27.00
Mail
$27.00
Members save up to 40% off list price.
Share
HTML for Linking to Page
Page URL

Related Items

Article
2017-03-13
Technical Paper / Journal Article
2010-04-12
Technical Paper / Journal Article
2010-04-12
Training / Education
2018-02-12