In this study quantitative techniques were established to assess the low temperature durability of commercially available mat systems. A new low temperature dynamic resistive thermal exposure (LT-RTE) test method was developed. The mats were evaluated in thermal cycling with maximum substrate skin temperatures from 280°C to 450°C.Results indicate that at low use temperatures the residual shear strength of the mat fell to ∼5-15KPa following 280°C cycling. Under the same LT-RTE exposure conditions an equivalent mat system, following thermal preconditioning to 500°C for 3 hours, possessed a residual shear strength of ∼30KPa. An alternative mat system with a lower shot content fiber was also evaluated, following the same thermal preconditioning previously described. This alternative mat was found to exhibit substantially higher residual shear strengths following LT-RTE aging. A residual shear strength of ∼95KPa was observed for this alternative mat following 280°C LT-RTE aging. This represents a substantial increase in low temperature behavior.This study demonstrates that ceramic substrates may be packaged durably for use at low temperature operating conditions.