A Unified Approach to Solder Joint Life Prediction

Paper #:
  • 2000-01-0454

Published:
  • 2000-03-06
Citation:
Qian, Z., Shi, L., and Liu, S., "A Unified Approach to Solder Joint Life Prediction," SAE Technical Paper 2000-01-0454, 2000, https://doi.org/10.4271/2000-01-0454.
Pages:
10
Abstract:
A unified approach has been developed and applied to solder joint life prediction in this paper, which indicates a breakthrough for solder joint reliability simulation. It includes the material characterization of solder alloys, the testing of solder joint specimens, a unified viscoplastic constitutive framework with damage evolution, numerical algorithm development and implementation, and experimental validation. The emphasis of this report focuses on the algorithm development and experimental verification of proposed viscoplasticity with damage evolution.
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