WRAPFORM-II: A New Binder FormingSimulation Method

Paper #:
  • 2000-01-1106

Published:
  • 2000-03-06
Citation:
Chen, K., "WRAPFORM-II: A New Binder FormingSimulation Method," SAE Technical Paper 2000-01-1106, 2000, https://doi.org/10.4271/2000-01-1106.
Author(s):
Pages:
9
Abstract:
WRAPFORM is a mathematical model and computer program for calculating binder wrap surface shape. It employs punch-opening line of the die as a geometric input and does not use the complete binder surface. This paper presents WRAPFORM-II, an improvement of the WRAPFORM model by including the binder surface geometry in the simulation. The new model has been applied to several dies and results are compared to those of the base WRAPFORM model. For a decklid die reported in the literature, whose simulated binder wrap showed bifurcation possibilities, straightforward application of WRAPFORM-II predicts a more plausible result which is consistent with the original design intent. In another case, WRAPFORM-II predicted the feasibility of a design to put more material into the die cavity. Other applications show slightly improved simulation results by using WRAPFORM-II.
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