Advanced Components and Techniques for Cryogenic Integration 2001-01-2378

This paper describes the development and testing status of several novel components and integration tools for space-based cryogenic applications. These advanced devices offer functionality in the areas of cryogenic thermal switching, cryogenic thermal transport, cryogenic thermal storage, and cryogenic integration. As such, they help solve problems associated with cryocooler redundancy, across-gimbal thermal transport, large focal plane array cooling, fluid-based cryogenic transport, and low vibration thermal links. The devices discussed in the paper include a differential thermal expansion cryogenic thermal switch, an across-gimbal thermal transport system, a cryogenic loop heat pipe, a cryogenic capillary pumped loop, a beryllium cryogenic thermal storage unit, a high performance flexible conductive link, a kevlar cable structural support system, and a high conductance make-break cryogenic thermal interface.