Browse Publications Technical Papers 2004-01-1482
2004-03-08

Virtual Key Life Tests of Instrument Panels for Product Development 2004-01-1482

Visteon has developed a CAE procedure to qualify instrument panel (IP) products under the vehicle key life test environments, by employing a set of CAE simulation and durability techniques. The virtual key life test method simulates the same structural configuration and the proving ground road loads as in the physical test. A representative dynamic road load profile model is constructed based on the vehicle proving ground field data. The dynamic stress simulation is realized by employing the finite element transient analysis. The durability evaluation is based on the dynamic stress results and the material fatigue properties of each component. The procedure has helped the IP engineering team to identify and correct potential durability problems at earlier design stage without a prototype. It has shown that the CAE virtual key life test procedure provides a way to speed up IP product development, to minimize prototypes and costs. With virtual test method we can gain the insight relationship into the design parameters, component weak spots and product life, provide the guidance to design improvement, and achieve our goal for only one successful physical key life test.

SAE MOBILUS

Subscribers can view annotate, and download all of SAE's content. Learn More »

Access SAE MOBILUS »

Members save up to 16% off list price.
Login to see discount.
Special Offer: Download multiple Technical Papers each year? TechSelect is a cost-effective subscription option to select and download 12-100 full-text Technical Papers per year. Find more information here.
We also recommend:
TECHNICAL PAPER

Simulation Methods for Door Module Design

2005-01-0883

View Details

JOURNAL ARTICLE

Squeak & Rattle Correlation in Time Domain using the SAR-LINE™ Method

2012-01-1553

View Details

TECHNICAL PAPER

Casting Design for Structural Components - Time-Saving Path to Successful Metalcasting Structures

2002-01-0915

View Details

X