Packaging for Next Generation Automotive Electronics 2004-01-1683
This paper describes the packaging impacts of forecast advances in automotive electronics in two significant areas:
The need for a much higher processing performance than is currently found in automotive applications.
The need for a much higher network performance within a vehicle.
In particular, the thermal and EMC issues resulting from these advances are discussed, and practical, cost effective, automotive relevant, solutions are proposed. To illustrate these issues in a realistic situation, a prototype implementation of a network vehicle controller has been developed.
