Analysis of Degradation Mechanism of Lead-Free Materials
Date Published: 2009-04-20
Paper Number:2009-01-0260
DOI: 10.4271/2009-01-0260
Citation:
Nomura, T., Shibata, Y., Sakano, M., and Konda, S., "Analysis of Degradation Mechanism of Lead-Free Materials," SAE Technical Paper 2009-01-0260, 2009, doi:10.4271/2009-01-0260.
Author(s):
Takashi Nomura - Toyota Motor Corp.
Yasufumi Shibata - Toyota Motor Corp.
Mitsuru Sakano - Toyota Motor Corp.
Shigeru Konda - Toyota Motor Corp.
Abstract:
The use of lead-free (Pb-free) solder and plating in onboard electronic components has accelerated rapidly in recent years, but solutions have yet to be found for the issues of whisker generation in tin (Sn) plating and crack initiation in Pb-free solder, despite widespread research efforts. Analysis of the whisker generation mechanism has focused on internal energy levels and crystal orientation, and analysis of the crack initiation mechanism in Pb-free solder has examined changes in the grain boundaries of Sn crystals.
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