An overview of Lead-Free Soldering for Brazilian Automotive Electronics Applications

Paper #:
  • 2010-36-0187

Published:
  • 2010-10-06
Citation:
de Almeida, I. and Brewer, S., "An overview of Lead-Free Soldering for Brazilian Automotive Electronics Applications," SAE Technical Paper 2010-36-0187, 2010, https://doi.org/10.4271/2010-36-0187.
Pages:
11
Abstract:
More than ever before, electronics industries manufactures around the world are required to improve products by substituting Tin/Lead for lead-free solders in accordance with European directives on End of Life Vehicles (ELV) and Waste Electrical and Electronic Equipment (WEEE) and Restriction on Hazardous Substances (RoHS). Similarly, the European directive on End of Life Vehicles (ELV) affect the automotive sector where lead-based solders frequently are the main application for joining electronics and electrical applications under hood and in passenger compartment devices such as GPS locators and audio/video entertainment media. The purpose of this article is to provide an overview of the legislation around the world and the impact to Brazilian automotive market.
Access
Now
SAE MOBILUS Subscriber? You may already have access.
Buy
Select
Price
List
Download
$28.00
Mail
$28.00
Members save up to 42% off list price.
Share
HTML for Linking to Page
Page URL

Related Items

Event
2018-04-10
Technical Paper / Journal Article
2009-11-03