Stress Measurement Techniques for Quantification of Stresses using X Ray Diffraction

Paper #:
  • 2011-26-0056

Published:
  • 2011-01-19
Citation:
Deshmukh, P. and Satish, B., "Stress Measurement Techniques for Quantification of Stresses using X Ray Diffraction," SAE Technical Paper 2011-26-0056, 2011, https://doi.org/10.4271/2011-26-0056.
Pages:
9
Abstract:
Accurate quantification of residual stresses is critical to predict expected fatigue life of the component. Quantification of residual stresses by X ray diffraction method offers substantial accuracy in results as compared to other methods of stress measurements. Depending on component processing and geometry, various stress measurement techniques are used to analyze stress patterns induced by these processing. This paper describes some of the stress measurement techniques by results obtained on two compressor valve (reed) samples which are undergone different processing. First reed sample is analyzed after blanking operation which is expected to give low compressive or tensile stresses whereas second reed sample is analyzed after tumbling operation which is done to get high compressive stresses. Results of analysis showed high compressive residual stresses with less stress variation on tumbled reed sample as compared to blanked reed sample, indicating more favourable distribution of compressive residual stresses after tumbling process.
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