Browse Publications Technical Papers 2012-01-0354
2012-04-16

Analysis of the Cooling Plant of a High Performance Motorbike Engine 2012-01-0354

This paper is based on a Research Project of the Department of Mechanical Engineering (DiME) in collaboration with Aprilia, the Italian motorbike manufacturer. In an attempt to simulate the functioning of the cooling plant of the Aprilia RSV-4 motorbike a numerical model was constructed using mono-dimensional and three-dimensional simulation codes. Our ultimate aim was to create a simulation model which could be of assistance to engine designers to improve cooling plant performance, thereby reducing research and development costs. The model allows to simulate the running conditions of the whole cooling circuit upon variations in environmental and running conditions.
In particular, the centrifugal pump of the cooling plant was simulated by a 3D commercial software, while the whole circuit was built by a 1D commercial code which allows simulation of all the thermal exchanges and pressure drops in the cooling circuit._An experimental campaign was also performed to obtain data to properly set and tune the numerical model. The cooling circuit was instrumented by thermocouples and pressure transducers in several points, and the motorbike was installed on a motorbike test bench, where several tests, in steady and transient conditions, and in different engine running conditions were performed.

SAE MOBILUS

Subscribers can view annotate, and download all of SAE's content. Learn More »

Access SAE MOBILUS »

Members save up to 16% off list price.
Login to see discount.
Special Offer: Download multiple Technical Papers each year? TechSelect is a cost-effective subscription option to select and download 12-100 full-text Technical Papers per year. Find more information here.
We also recommend:
Book
BOOK

Honda R&D Technical Review: April 2011

View Details

TECHNICAL PAPER

Optimization of the Customer Experience for Routine Handling Performance

2015-01-1588

View Details

TECHNICAL PAPER

Approximating Convective Boundary Conditions for Transient Thermal Simulations with Surrogate Models for Thermal Packaging Studies

2019-01-0904

View Details

X