High-Temperature, Distributed Control using Custom CMOS ASICs 2012-01-2210
Four application specific integrated circuits (ASICs) which provide sensing, actuation, and power conversion capabilities for distributed control in a high-temperature (over 200°C) environment are presented. Patented circuit design techniques facilitate fabrication in a conventional, low-cost, 0.5 micron bulk Complimentary Metal Oxide Semiconductor (CMOS) foundry process. The four ASICs are combined with a Digital Signal Processor (DSP) to create a distributed control node. The design and performance over temperature of the control system is discussed. Various applications of the control system are proposed. The authors also discuss various design techniques used to achieve high reliability and long life.
Citation: Majerus, S., Howe, D., Garverick, S., Merrill, W. et al., "High-Temperature, Distributed Control using Custom CMOS ASICs," SAE Technical Paper 2012-01-2210, 2012, https://doi.org/10.4271/2012-01-2210. Download Citation
Author(s):
Steve Majerus, Daniel Howe, Steven Garverick, Walt Merrill, Kenneth Semega
Affiliated:
Scientific Monitoring Inc., Case Western Reserve University, Air Force Research Lab
Pages: 9
Event:
SAE 2012 Power Systems Conference
ISSN:
0148-7191
e-ISSN:
2688-3627
Related Topics:
Control systems
Integrated circuits
Fabrication
Semiconductors
Reliability
Metals
SAE MOBILUS
Subscribers can view annotate, and download all of SAE's content.
Learn More »
