Four application specific integrated circuits (ASICs) which provide sensing, actuation, and power conversion capabilities for distributed control in a high-temperature (over 200°C) environment are presented. Patented circuit design techniques facilitate fabrication in a conventional, low-cost, 0.5 micron bulk Complimentary Metal Oxide Semiconductor (CMOS) foundry process. The four ASICs are combined with a Digital Signal Processor (DSP) to create a distributed control node. The design and performance over temperature of the control system is discussed. Various applications of the control system are proposed. The authors also discuss various design techniques used to achieve high reliability and long life.