Thin film sensors are often used for in-situ measuring. They are composed of a sensor/conductor layer and insulation layers on either side. However, delamination often occurs between the insulation layers and the sensor/conductor layer and makes the sensor life span shorter. This problem is found especially when there is continuous stress caused by the cyclic change of temperature, sliding and tension. By observing the microstructure of the sensor with transmission electron microscope (TEM), it was found that the adhesion force at the interface between the insulation layer and the sensor/conductor layer, where delamination occurs, is not strong enough, because the interface is too flat. By deposition a thin insulator layer with rough surface on the normal insulation layer, the delamination was successfully suppressed.