Yang, G., Wang, J., Zhu, Q., Fang, R. et al., "The Research Progress of Dynamic Photo-Elastic Method," SAE Technical Paper 2014-01-0829, 2014, doi:10.4271/2014-01-0829.
With the rapid development of computing technology, high-speed photography system and image processing recently, in order to meet growing dynamic mechanical engineering problems demand, a brief description of advances in recent research which solved some key problems of dynamic photo-elastic method will be given, including:(1) New digital dynamic photo-elastic instrument was developed. Multi-spark discharge light source was replaced by laser light source which was a high intensity light source continuous and real-time. Multiple cameras shooting system was replaced by high-speed photography system. The whole system device was controlled by software. The image optimization collection was realized and a strong guarantee was provided for digital image processing. (2)The static and dynamic photo-elastic materials were explored. The new formula and process of the dynamic photo-elastic model materials will be introduced. The silicon rubber mold was used without the release agent. The epoxy resin sheet or block was solidified at room temperature and could be poured accurately once. The materials had good photodynamic property. (3)The dynamic photo-elastic was applied in engineering. Some research was made by using the new digital dynamic photo-elastic instrument and the new process of epoxy resin pouring. Some valuable accomplishments were obtained. The dynamic stress was analyzed with instances like parts of steering gear and base in a ship, the key pile of port in coastal engineering and the connection part of the bolts and nuts. The new instrument and materials proved to meet the experiment demand which had a broad prospects of development.