Improvement of Adhesion Properties between Epoxy Resin and Primer and between Primer and Ni Plating in Hybrid Vehicle Power Semiconductor Module under High Temperature Conditions

Paper #:
  • 2016-01-0500

Published:
  • 2016-04-05
DOI:
  • 10.4271/2016-01-0500
Citation:
Kato, A., Takano, M., Hase, K., Inuzuka, S. et al., "Improvement of Adhesion Properties between Epoxy Resin and Primer and between Primer and Ni Plating in Hybrid Vehicle Power Semiconductor Module under High Temperature Conditions," SAE Technical Paper 2016-01-0500, 2016, https://doi.org/10.4271/2016-01-0500.
Pages:
6
Abstract:
In this report, adhesion mechanism between epoxy resin and primer and between primer and Ni platting in Hybrid vehicle (HV) was investigated. Adhesion forces are thought to be a combination of mechanical bond forces (such as anchor effect), chemical bond forces and physical bond forces (such as hydrogen bonding and Van der Waals force). Currently there is insufficient understanding of the adhesion mechanism. In particular, the extent to which the three bond forces contribute to adhesion strength. So the adhesion mechanism of polyimide primers was analyzed using a number of different methods, including transmission electron microscope (TEM) and atomic force microscope (AFM) observation, to determine the contributions of the three bonding forces. Molecular simulation was also used to investigate the relationship between adhesion strength and the molecular structure of the primer.
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