Inspection and Control Requirements for Hot Gas Soldered Flat Pack Connections 670215
Acceptance of the flat pack as a standard configuration for integrated circuits has stimulated development of new interconnection techniques which necessitated development of new criteria and controls for these techniques. One method being utilized at Martin-Denver is a hot gas soldering process in which the solder joints are made by passing the printed circuit board containing the flat packs under hot gas jets. Specification of this process for a possible space application necessitated development of inspection criteria and controls to ensure the required joint reliability. This was accomplished concurrently with development of the soldering process and qualification method.
