New packaging concepts for avionics equipment are evolving as a result of extensive use of microcircuits and thin film circuits. These components, essentially planar in configuration, have naturally led to the development of new planar packaging systems. A system of this type currently being implemented uses planar circuit boards of a unique new design and also provides a method of packaging these boards in separate planar sections. Two or more of these sections, each with its own connector and dust cover, may constitute a complete airborne function such as VOR or VHF communication. The sections, which are shorter than standard ARINC units because of increased packaging efficiency, also facilitate equipment installation in smaller aircraft.
