Laser Welding of Microcircuit Interconnections - Simultaneous Multiple Bonds of Aluminum to Kovar 680802
The development of a laser welder to produce multiple welds/laser pulse for use in a flip-chip process is described. Using a glass laser with a blocking mask to split the laser beam into a multiplicity of spots, the simultaneous welding of all 14 interconnect points between an aluminum interconnect pattern on a glass substrate and an unplated Kovar lead frame is possible, weld shear strength of from 800 – 1200 grams in eight-spot samples was achieved in an experimental system.
Citation: Battista, A. and Ponti, M., "Laser Welding of Microcircuit Interconnections - Simultaneous Multiple Bonds of Aluminum to Kovar," SAE Technical Paper 680802, 1968, https://doi.org/10.4271/680802. Download Citation
Author(s):
A. D. Battista, M. A. Ponti
Affiliated:
American Optical Corp., Sprague Electric Co.
Pages: 9
Event:
Micro Electronic Packaging Conference
ISSN:
0148-7191
e-ISSN:
2688-3627
Related Topics:
Welding
Lasers
Aluminum
Glass
Frames
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