Chip-in-Glass FIP's (Fluorescent Indicator Panel) for Automotive Applications 870209
This paper describes the latest Fluorescent Indicator Panel (FIP) technology, featuring integrated circuits mounted within the vacuum envelope on the glass substrate. This is called Chip-in-Glass FIP, or CIG FIP. The discussion includes basic technologies, design flexibility, reliability, and driver ICs.
Citation: Yoshida, Y. and Ishizuka, A., "Chip-in-Glass FIP's (Fluorescent Indicator Panel) for Automotive Applications," SAE Technical Paper 870209, 1987, https://doi.org/10.4271/870209. Download Citation
Author(s):
Yukitoshi Yoshida, Akira Ishizuka
Affiliated:
NEC Corp.
Pages: 8
Event:
SAE International Congress and Exposition
ISSN:
0148-7191
e-ISSN:
2688-3627
Also in:
Recent Developments in Anutomotive Electronic Displays and Information Systems-SP-0694
Related Topics:
Integrated circuits
Vehicle drivers
Reliability
Vacuum
Glass
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