Current and Future Trends in Instrument Cluster Flexible Printed Circuit Technology

Paper #:
  • 930545

Published:
  • 1993-03-01
Citation:
Lindahl, B. and Rolfe, J., "Current and Future Trends in Instrument Cluster Flexible Printed Circuit Technology," SAE Technical Paper 930545, 1993, https://doi.org/10.4271/930545.
Pages:
8
Abstract:
Sheldahl is one of the world's largest suppliers of flexible printed circuits (FPC). Sheldahl has been supplying back can FPCs for automotive instrument clusters for over 25 years. The complexity of today's instrument clusters has required higher density and multifunctional FPCs to add value, reduce part number count, increase reliability, reduce electrical interconnects and reduce cost.This paper will discuss some of the new applications that have come about in recent years as a result of technological advances and integrating more functions into the FPC. Single layer, double layer, double sided plated through hole, rigidized flex and hybrid polyester/polyimide FPCs will be discussed.
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