Multi-Chip Modules for Automotive Applications

Paper #:
  • 931838

Published:
  • 1993-08-01
Citation:
McCaffrey, P., "Multi-Chip Modules for Automotive Applications," SAE Technical Paper 931838, 1993, https://doi.org/10.4271/931838.
Pages:
14
Abstract:
Increased functionality, increased reliability and reduced system costs have been the driving forces behind silicon integration. However, conventional packaging options are becoming a barrier both technologically and in terms of cost effectiveness to further silicon integration. Multi-chip modules (MCMs) provide a cost effective solution to handling the most advanced of silicon chips while increasing reliability. An example of an automotive system which merits the use of thin film (MCM-D) technology is described. The preferred type of interconnect for this circuit together with the alternatives is discussed, with emphasis on the multi-chip module substrate.
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