Thermal Accommodation of Attached Pressurized Module Payloads

Paper #:
  • 941570

Published:
  • 1994-06-01
Citation:
Laux, U., Behrens, B., Gargioli, E., and Gastaldi, C., "Thermal Accommodation of Attached Pressurized Module Payloads," SAE Technical Paper 941570, 1994, https://doi.org/10.4271/941570.
Pages:
9
Abstract:
The backbone of the Attached Pressurized Module (APM) is the water cooling loop, which contributes to an optimized payload operation. Dedicated design means are proposed to allow an efficient use of this resource.In case of a Thermal Control System (TCS) failure a controlled run-down of individual payloads is possible to avoid critical situations like overheating due to heat soak back from a furnace. The TCS is flexible enough to allow short payload power peaks thus optimizing the resource allocation without violation of the thermal requirements regarding the temperature limits.The APM will be verified against generic thermal and environmental control requirements. The test and analytical verification effort on payload side is dependant whether the payload is a facility integrated in an International Standard Payload Rack (ISPR) or a smaller entity like a drawer as subset of a facility or a self-standing experiment.
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