Ultra-High Thermal Conductivity Substrate for Electronic Components

Paper #:
  • 942186

Published:
  • 1994-10-01
Citation:
Lake, M., Ting, J., Jacobsen, R., Lagounov, A. et al., "Ultra-High Thermal Conductivity Substrate for Electronic Components," SAE Technical Paper 942186, 1994, https://doi.org/10.4271/942186.
Pages:
10
Abstract:
The development of chemically vapor deposited (CVD) diamond promises to greatly impact numerous technologies, and in particular the field of thermal management. Despite its current high cost, the physical properties of CVD diamond are so attractive, compared to currently implemented materials, that its use is justified in a few demanding or previously impossible applications. Unfortunately, at $50 or more per carat, the cost/performance ratio is well beyond the limits that would make it useful for many more widely spread applications. This paper describes an affordable variant of CVD diamond that is under development for thermal management in electronics. This material, designated “diamond/carbon/carbon composite,” consists of a carbon/carbon composite that is partially infiltrated with CVD diamond in the surface region. The performance advantages of DCC relative to current thermal management materials are analyzed, and the cost advantages relative to pure CVD diamond are discussed.
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