Design Development of High Temperature Manifold Converter Using Thin Wall Ceramic Substrate

Paper #:
  • 971030

Published:
  • 1997-02-24
Citation:
Umehara, K., Yamada, T., Hijikata, T., Makino, M. et al., "Design Development of High Temperature Manifold Converter Using Thin Wall Ceramic Substrate," SAE Technical Paper 971030, 1997, https://doi.org/10.4271/971030.
Pages:
9
Abstract:
This paper proposes a high temperature manifold converter with a thin wall ceramic substrate, such as; 4mil/400cpsi and 4mil/600cpsi. Double-wall cone insulation design was proposed for close-coupled converters to protect the conventional intumescent mat from high temperature. However, the double wall cone insulation is not applicable when the converter is directly mounted to the exhaust manifold without an inlet cone. The prototype manifold converter was tested under hot vibration test with a non-intumescent ceramic fiber mat and retainer rings as a supplemental support. The converter demonstrated durability for 10 hours under 80G acceleration and 100 hours under 60G acceleration with 1,050 °C catalyst bed temperature. The skin temperature of the heat shield was kept below 400 °C.
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