Thermal and Acoustical Modeling of Multispan Sandwich Panels with Complex Boundary Conditions

Paper #:
  • 975533

Published:
  • 1997-10-01
Citation:
Murer, Y., Millan, P., and Pauzin, S., "Thermal and Acoustical Modeling of Multispan Sandwich Panels with Complex Boundary Conditions," SAE Technical Paper 975533, 1997, https://doi.org/10.4271/975533.
Pages:
12
Abstract:
This paper presents a thermal and acoustical modeling of multilayer sandwich panels which is dedicated to design and optimization steps in aeronautical and spatial industries. The acoustical part of the model describes free and forced vibrations, and radiation of multispan plates; particular attention is paid to the boundary conditions on the edges of the plate (elastic restraints, local clamping, etc.). The different heat transfer modes occurring in sandwich plates are reduced to develop a conductive equivalent model with convective conditions on the face of the plate. Various experiments allow a first validation of the model.
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