PBGA Reliability Study for Automotive Applications

Paper #:
  • 980341

Published:
  • 1998-02-23
Citation:
Adams, R., Glovatsky, A., Lindley, T., Evans, J. et al., "PBGA Reliability Study for Automotive Applications," SAE Technical Paper 980341, 1998, https://doi.org/10.4271/980341.
Pages:
9
Abstract:
Plastic Ball Grid Array (PBGA) packages have been used in many applications. Most studies designed to verify solder joint reliability and package integrity have focused on commercial applications (Temperature Cycling range 0°C to 100°C). Other studies have shown that this package design will not meet the requirements for automotive applications.1 Design enhancements aimed at making the PBGA more robust and capable of being used in automotive application have been suggested. A joint effort by Chrysler, Delco Electronics, Ford Visteon Automotive Systems, and Motorola Semiconductor was organized to design and test PBGA packages for automotive applications and to develop module assembly processes for PBGA packages.
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