Correlation of Thermal Cycle Tests to Field Usage Profiles for Solder Joints in Automotive Electronics

Paper #:
  • 980344

Published:
  • 1998-02-23
Citation:
Hu, J. and Garfinkel, G., "Correlation of Thermal Cycle Tests to Field Usage Profiles for Solder Joints in Automotive Electronics," SAE Technical Paper 980344, 1998, https://doi.org/10.4271/980344.
Pages:
8
Abstract:
This paper reviews the physics-of-failure model for accelerated thermal cycle tests of solder joints associated with various electronics components, summarizes the parameters of the automotive environment, and discusses the methods for developing thermal cycle tests for reliability validation for automotive electronics. The paper proposes an approach to develop the requirements for validation tests based on the customer usage profiles and the desired product life goal. This requirement determines the nominal testing duration based on the equivalent damage generated from the worst-case field applications.
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