Transient Thermal Analysis of Power Electronics

Paper #:
  • 980346

Published:
  • 1998-02-23
Citation:
Luettgen, M., "Transient Thermal Analysis of Power Electronics," SAE Technical Paper 980346, 1998, https://doi.org/10.4271/980346.
Author(s):
Pages:
13
Abstract:
This paper describes a method for calculating the temperature of a semi-infinite heat sink plate of a given thickness, subjected to transient heating by a D2Pak power IC. Accurate prediction of the heat sink temperature over time then allows for more accurate calculation of the IC junction temperature. A set of curves have been developed for the time variation of heat sink plate temperature. This has been achieved by the use of finite element methods, and modeling a large range of configurations. The system variables were put into dimensionless form, and the model results plotted. The resulting plot indicates an effective thermal resistance of a given heat sink plate at a given point in time. A curve fit has also performed on the results. The results of the finite element model have been compared with laboratory data.
Access
Now
SAE MOBILUS Subscriber? You may already have access.
Buy
Select
Price
List
Download
$27.00
Mail
$27.00
Members save up to 40% off list price.
Share
HTML for Linking to Page
Page URL

Related Items

Technical Paper / Journal Article
2010-09-28
Technical Paper / Journal Article
2010-10-25
Training / Education
2013-04-09
Training / Education
2013-04-09
Article
2017-03-13
Training / Education
2013-04-09