In-Mold Cure Monitoring of Phenolic Molding Materials

Paper #:
  • 980752

Published:
  • 1998-02-23
Citation:
Landi, V., Shepard, D., and Smith, K., "In-Mold Cure Monitoring of Phenolic Molding Materials," SAE Technical Paper 980752, 1998, https://doi.org/10.4271/980752.
Pages:
8
Abstract:
A new method and associated equipment has been developed for non-destructively following the progress of the cure of thermoset phenolic molding materials, during a molding operation. It is based on passing an ultrasonic pulse signal through the material as it is curing. The velocity of sound in the material increases monotonically with increases in modulus. Modulus, in turn, increases with increasing degree of cure. Through this method, it is possible to determine when a molded part is sufficiently cured to be removed from the mold. Cure development during compression molding is reported on four phenolic molding compounds, at three different cure temperatures.
Access
Now
SAE MOBILUS Subscriber? You may already have access.
Buy
Select
Price
List
Download
$27.00
Mail
$27.00
Members save up to 40% off list price.
Share
HTML for Linking to Page
Page URL

Related Items

Article
2017-03-17
Training / Education
2017-10-27
Training / Education
2017-10-23
Training / Education
2017-10-31
Technical Paper / Journal Article
2010-10-25
Technical Paper / Journal Article
2010-09-28