Design and Development of a Generic Door Hardware Module Concept

Paper #:
  • 980999

Published:
  • 1998-02-23
Citation:
Hoff, T., Madej, J., Goral, T., Ryntz, C. et al., "Design and Development of a Generic Door Hardware Module Concept," SAE Technical Paper 980999, 1998, https://doi.org/10.4271/980999.
Pages:
14
Abstract:
This paper documents the design methodology, part performance, and economic considerations for a generic hardware module applied to a front passenger-car door. Engineering thermoplastics (ETPs), widely used in automotive applications for their excellent mechanical performance, design flexibility, and parts integration, can also help advance the development of modular door-hardware systems. Implementation of these hardware carriers is being driven by pressures to increase manufacturing efficiencies, reduce mass, lower part-count numbers, decrease warranty issues, and cut overall systems costs. In this case, a joint team from GE Plastics, Magna-Atoma International/Dortec, and Excel Automotive Systems assessed the opportunity for using a thermoplastic door hardware module in a current mid-size production vehicle. Finite-element analysis showed that the thermoplastic module under study withstood the inertial load of the door being slammed shut at low, room, and elevated temperatures.
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