Software/Hardware Systems, Systems Engineering, Advanced Electronics Packaging, and Electromagnetic Compatibility (Emc)
Date Published: 2004-03-08
Paper Number:SP-1857
Citation:
"Software/Hardware Systems, Systems Engineering, Advanced Electronics Packaging, and Electromagnetic Compatibility (Emc)," SAE Technical Paper SP-1857, 2004, doi:doi-1000001407.
Abstract:
This SAE Special Publication presents papers from the sessions Software/Hardware Systems, Systems Engineering, Advanced Automotive Electronics Packaging, and Electromagnetic Compatibility (EMC).A special publication is a print collection of technical papers from one or more sessions presented at an SAE conference. Based on key challenges facing the industry, these papers provide research and findings from leading technical experts focusing on a specific topic.
To see a listing of papers included in this special publication, click on the papers link below.
Format:
Softbound
Product Status: In Stock
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