Realizing Distributed Engine Control Subsystems through Application of High Temperature Intelligent Engine Sensors and Control Electronics 2000-01-1363
This paper illustrates a new and cost effective approach to the design and manufacture of intelligent sensors and control electronics that reliably operate up to 300 Degrees Centigrade. A description of this Silicon-on-insulator (SOI) technology for creating both the sensors and integrated circuits is provided. Measured results that demonstrate the inherent reliability of this technology at high temperatures are presented. Representative distributed control architectures and applications such as engine control units; valve position sensors and exhaust gas recirculation sensor electronics are illustrated. A new, SOI-based, 32-bit microprocessor powerful enough to form the “core” of an advanced engine control unit is described.
Citation: Wick, D., "Realizing Distributed Engine Control Subsystems through Application of High Temperature Intelligent Engine Sensors and Control Electronics," SAE Technical Paper 2000-01-1363, 2000, https://doi.org/10.4271/2000-01-1363. Download Citation
Author(s):
David G. Wick
Affiliated:
Honeywell SSEC
Pages: 6
Event:
SAE 2000 World Congress
ISSN:
0148-7191
e-ISSN:
2688-3627
Also in:
Automotive Electronics Reliability-PT-82, Electronic Engine Control Technologies, 2nd Edition-PT-110, Sensors and Transducers, Second Edition-PT-105, SAE 2000 Transactions Journal of Engines-V109-3
Related Topics:
Exhaust gas recirculation (EGR)
Integrated circuits
Sensors and actuators
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