1969-02-01

DISCRETE ASSEMBLIES VS. THICK FILM IC’s 690013

Thick Film is an old technology that is finding new applications. Many of the future integrated circuits for the automotive industry will employ Thick Film Technology. It offers an easy transition from discrete component assemblies, while providing lower overall costs and improved reliability.

SAE MOBILUS

Subscribers can view annotate, and download all of SAE's content. Learn More »

Access SAE MOBILUS »

Members save up to 16% off list price.
Login to see discount.
Special Offer: Download multiple Technical Papers each year? TechSelect is a cost-effective subscription option to select and download 12-100 full-text Technical Papers per year. Find more information here.
We also recommend:
TECHNICAL PAPER

Field Measurements of Seated Vibrations

960477

View Details

JOURNAL ARTICLE

Study on Development of Torque and Angle Sensor for EPS

2012-01-0941

View Details

TECHNICAL PAPER

Transient Stability Analysis of DC Solid State Power Controller (SSPC) for More Electric Aircraft

2018-01-1927

View Details

X