High-Modulus/Low-Conductivity Windshield Adhesives for Better Body Stiffness, Comfort and Durability

Detlef Symietz; Bernardo Walterspiel

doi:10.4271/980464

1998-02-23

High-Modulus/Low-Conductivity Windshield Adhesives for Better Body Stiffness, Comfort and Durability 980464

A life-cycle analysis of the direct glazing technology is given. Most of the latest changes and improvements were accomplished and implemented in Europe. The current status of direct glazing technology is also described and covers the following:

High-modulus adhesives that significantly increase body stiffness on a weight-neutral basis.
Low electrically conductive adhesives specially designed for aluminum cars that fulfill requirements for windshield- or backlite-integrated antenna systems.
Instant-fix adhesives for easier mounting operations.
A detailed discussion of the advantages and disadvantages of these technologies based on real practice.
An outlook into the future of direct glazing.

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High-Modulus/Low-Conductivity Windshield Adhesives for Better Body Stiffness, Comfort and Durability 980464

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