Investigation to Develop Optimum Short-Term Screen Tests for Integrated Circuits 670610
The techniques of device manufacturing control and screen testing employed today allows an escape rate of latent defects which makes probability of mission success of a manned interplanetary mission questionable.
The increased system complexity and mission duration underscore the need to establish maximum integrated circuit reliability and a test sequence to prove that it exists.
This paper describes a technique of utilizing life distributions of Integrated circuits obtained under high-stress testing to establish reliability screening criteria. Discussed are the basic factors controlling observable lot behavior, what can be learned from them, and how they dictate a test approach. Analyzed are the typical life expectancy distributions obtainable from today's devices; what the probable escape rates of defective devices are; how they may be made observable; and finally, how the expected life of accepted devices may be altered by stress screening. The lot behavior analysis will also define the existence of device threshold stress level capabilities from which the screenability of lots can be determined
The philosophies and approach discussed can provide a yard stick with which device manufacturing line control can be monitored as well as provide a basis for selecting an optimum device screening criteria.
Citation: Cross, D. and Rumpza, W., "Investigation to Develop Optimum Short-Term Screen Tests for Integrated Circuits," SAE Technical Paper 670610, 1967, https://doi.org/10.4271/670610. Download Citation
Author(s):
D. A. Cross, W. R. Rumpza
Affiliated:
Launch Systems Technology, The Boeing Co.
Pages: 9
Event:
6th Annual Reliability and Maintainability Conference
ISSN:
0148-7191
e-ISSN:
2688-3627
Related Topics:
Integrated circuits
Logistics
Reliability
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