Advances in Polyamide 4T for Lead Free Solder Surface Mount Technology (SMT) Applications

Paper #:
  • 2013-01-1776

Published:
  • 2013-04-08
Citation:
Costantino, G., "Advances in Polyamide 4T for Lead Free Solder Surface Mount Technology (SMT) Applications," SAE Technical Paper 2013-01-1776, 2013, https://doi.org/10.4271/2013-01-1776.
Pages:
5
Abstract:
Surface Mount Technology (SMT) is a high-productivity and cost-effective circuit board assembly method used extensively in the consumer electronics industry. Regulations requiring lead-free solder have pushed the peak processing temperatures of SMT to as high as 270°C. This has resulted in the need for higher temperature performance from contact and circuit insulation. Considering the rise in infotainment content on vehicles, many onboard devices already employ the lead-free SMT process. The use of lead-free SMT processes now extends to the data and control circuit devices of safety, powertrain and other vehicle electronics.Polyamide 4T is a proven performer in lead-free solder SMT applications, namely connectors in the consumer and industrial electronics industries. The use of polyamide 4T naturally translates to traditional and emerging automotive electronics applications.Using polyamide 4T in lead-free SMT processes allows a design engineer to realize additional benefits of stable electrical properties, low warp, good dimensional stability, and the ability to design in environments with USCar Class 4 and higher continuous operating temperatures.With higher thermal, chemical and mechanical demands being placed on components in the engine compartment there will be an increasing demand for higher performance resins in electronics applications.Performance data will be given showing why polyamide 4T is the low risk choice compared to other high heat resins for automotive electronic SMT applications.
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