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Technical Paper

Mechanism of Deposit Formation in Wing Tanks

1968-02-01
680733
Deposits form in the “empty” wing tank environment as a result of a complex autoxidative degradation of the hydrocarbon fuel. For the past two years, Esso Research and Engineering Co. has been carrying out a fundamental study for the Air Force of the variables which control such deposit formation. Extensive studies have been carried out in a specially designed apparatus which simulates the kinetic environment found in a wing tank. Independent Advanced Aircraft Fuel System Simulator studies have shown that this apparatus is the only small test apparatus currently available which accurately rates the wing tank deposit formation tendency of jet fuels. Rigorous exclusion of oxygen has been demonstrated to eliminate deposit formation at temperatures up to 500 F. The rate of deposit formation from typical jet fuels exhibits a 10 kcal/mole apparent activation energy and a 0.2 order in oxygen partial pressure at moderate oxygen partial pressure levels.
Technical Paper

Agena Operational Experience

1968-02-01
680740
In 9 years of operational experience on Air Force and NASA programs, the Agena has proved to be a reliable vehicle. This paper describes the improving methods of operation over the years. Among these are testing the complete flight vehicle system under the closest possible simulation of the flight environment, the use of telemetry in conjunction with automated data handling systems, use of computerized data handling, and delivery of mate-ready flight vehicles to the launch bases. Each is discussed in detail.
Technical Paper

Saturn I/IB Launch Vehicle Operational Status and Experience

1968-02-01
680739
NASA's Saturn I/IB Launch Vehicle Program has been a remarkable success story in terms of flight accomplishments. Fourteen launch vehicles have flown without a single significant launch vehicle failure; that is, a failure that affected the mission objective. The present Saturn IB launch vehicle comprises an S-IB stage, an S-IVB stage, and an Instrument Unit stage. The S-IB stage and the S-IVB stage are propulsion or booster stages. The Instrument Unit houses the navigation, guidance, and control equipment. A variety of payloads has been flown on the launch vehicle and different types of payloads are planned for future flights; however, the primary payloads for which the launch vehicle was designed are the Command Service Module and the Lunar Module.
Technical Paper

Titan III Launch Vehicle Flight Test Experience

1968-02-01
680738
Titan III is the first space launching system development program directed from the start toward the objective of standardization; it is also the first such program to use the building block concept to achieve wide mission flexibility. The program objectives of the Titan III launching system are detailed, and its design philosophy explained. The development of the Titan III system is described, as is the test philosophy of the program. A chronological summary of flight test experience is included.
Technical Paper

Reliability and Maintainability Problems Confronting Environmental Control/Life Support Systems for Long Duration Space Flight

1968-02-01
680744
The reliability and maintainability problems confronting environmental control/life support systems for long duration space flight present the designer with one of the most challenging tasks in the wide array of still unproved approaches to the design of manned space systems. Examination of the realities of current equipment experience indicates that reliability and maintainability of most aerospace equipments are far from meeting requirements of long duration missions, and some concepts currently influencing designs are not applicable to the true characteristics of the manned spacecraft environment. Several examples are given of analytical processes and design techniques which show promise of making progress toward practical goals. Emphasis is placed on the requirement to see reliability and maintainability progress made as an integrated part of an orderly design maturation process.
Technical Paper

Evaluation of a Closed-Cycle Life-Support System During a 60-Day Manned Test

1968-02-01
680741
A 60-day manned test of a closed-cycle life-support system was completed in a Space Cabin Simulator. Life-support equipment was installed within the chamber and was operated, maintained, and repaired by a 4-man crew. Major objectives of the test included demonstrations of the recovery of potable water from urine and humidity condensate, and the recovery of oxygen from carbon dioxide. Other life-support equipment included a thermal-control subsystem, a two-gas atmosphere control, a trace-contaminant removal subsystem, and a fecal-waste collector that featured vacuum dehydration.
Technical Paper

Maintainability and Reliability of Environmental Control/Life Support Systems

1968-02-01
680745
Extensive maintainability (M) and reliability (R) studies of a number of manned spacecraft missions indicate that the Environmental Control/Life Support System (EC/LSS) generally requires more scheduled and unscheduled maintenance than any other subsystem. This paper summarizes the EC/LSS M and R analyses performed on some of these studies. The expected redundancy and spares required to achieve a desired reliability is discussed. The requirements for scheduled and unscheduled maintenance are evaluated in terms of expected spares usage, maintenance time, and potential problem areas.
Technical Paper

Low-Gravity Capabilities of Life Support System Components and Processes

1968-02-01
680742
In a study conducted to evaluate low-gravity capabilities of life support components and processes of the Langley Research Center Integrated Life Support System (ILSS), primary emphasis was placed on: 1. Identification and analysis of gravity sensitivities inherent in performance of ILSS components and processes. 2. Investigation of methods for experimentally evaluating critical items for which zero-gravity performance could not be determined by analytical techniques. 3. Formulation of generalized criteria for assessing gravity sensitivity of alternate or advanced life support processes as well as those originally incorporated in the ILSS. Of 92 ILSS processes identified, the majority were of such nature that their g sensitivities could be satisfactorily assessed by analyses, precluding the need for extensive testing. Experiments included gravity-sensitive aspects of liquid droplet release, heat exchanger passage plugging, and liquid film stability.
Technical Paper

Flat Cable Transmission Line Component Assemblies for Subsystem Interconnection

1968-02-01
680806
A new family of transmission line component assemblies for interconnection of electronic subsystems to transmit digital pulses is described. These assemblies consist of flat cable with closely controlled electrical characteristics terminated to printed circuit boards which either plug into standard card-edge connectors, or have standard connectors mounted on them. The construction of the flat cables and their electrical, mechanical, chemical, and thermal properties are described as are those of the printed circuit boards. The fabrication of the assemblies is outlined including cutting, stripping, soldering, and strain relief; and a time and cost study for a typical assembly is detailed.
Technical Paper

New Uses of the Electron Microprobe Analyzer in Analysis of Integrated Circuits and Packages

1968-02-01
680804
This paper describes the use of the electron microprobe analyzer as an analytical tool for microelectronic devices. A comprehensive description of the construction and working of the electron microprobe analyzer is first presented. Included is a brief description of some of the basic physical laws regarding X-ray generation and analysis. Three major innovations which have made the probe the tool for microelectronic analysis are described in detail; these are: the electron beam scanning system, secondary electron display, and high resolution nondispersive energy analysis. Several examples are shown Of how these techniques may be applied to microelectronic analysis.
Technical Paper

Semiconductor: Wire Bonding and Face Bonding Considerations and Comparisons

1968-02-01
680803
Begins with a review of semiconductor wire bonding techniques utilizing both thermocompression and ultrasonic methods. Next, disadvantages of using interconnect leadwires are covered. Finally, a description of leadless face bonding is included with emphasis on the important functions in state-of-the-art techniques as well as on simplicity, accuracy and repeatability.
Technical Paper

Laser Welding of Microcircuit Interconnections - Simultaneous Multiple Bonds of Aluminum to Kovar

1968-02-01
680802
The development of a laser welder to produce multiple welds/laser pulse for use in a flip-chip process is described. Using a glass laser with a blocking mask to split the laser beam into a multiplicity of spots, the simultaneous welding of all 14 interconnect points between an aluminum interconnect pattern on a glass substrate and an unplated Kovar lead frame is possible, weld shear strength of from 800 – 1200 grams in eight-spot samples was achieved in an experimental system.
Technical Paper

Design Consideration in Thick Film Hybrid Microcircuits Layout

1968-02-01
680801
Translation from a schematic to fabrication of a thick film hybrid microcircuit requires a knowledge of both circuit and process design. A lack of information in proper layout procedures often results in circuits which are unnecessarily difficult to fabricate. Design guidelines are given which aid in optimization of the circuit layout. Optimum geometries are discussed with particular emphasis on resistors. Examples of circuits are given from schematic to the finished product to illustrate the design layout procedure.
Technical Paper

The Honeywell FEB Interconnection Scheme

1968-02-01
680799
One of Honeywell Aerospace Division's major efforts to reduce design and production costs has been the application of standard Functional Electronic Blocks (FEB's) in systems design. The FEB's are thick-film, screen printed passive networks fired on ceramic substrates to which integrated circuits and miniature discrete components are attached. Each FEB provides a complete circuit function such as a servo amplifier, summing amplifier, or demodulation amplifier which can easily be incorporated into a system mechanization. This paper presents the results of a program to develop the interconnection techniques needed for attachment of components to the thick-film networks and describes some of the capabilities and advantages of these Functional Electronic Blocks.
Technical Paper

Paste Transfer in the Screening Process

1968-02-01
680796
This discussion describes the relationships of the amount of paste deposited on a ceramic substrate by screening, to certain aspects of the screening process - - such as the mesh size, paste rheology, line width, etc. It is not intended to be a vigorous mathematical or mechanical analysis of the process. The conclusions can be extrapolated not only to an understanding of a part of the mechanism of paste transfer, but to a prediction of screened thickness - - as well as to methods for increasing the uniformity and thickness of screened images. Emulsion screens with stainless steel mesh and etched metal masks are discussed.
Technical Paper

In-Process Non-Destructive Microweld Inspection Techniques

1968-02-01
680798
Degradation of weld strength beyond that which is unacceptable in the end product can always be detected non-destructively. This detection is best made during the weld cycle by monitoring a combination of three parameters: voltage pulse, infrared radiation, and setdown. Other measurements evaluated but found impractical are: eddy current, joint resistance, and sonic/ultrasonic methods. Laboratory experiments show that weld criteria and instrumentation are easily developed.
Technical Paper

Simplified Automation of Microelectronic Module Interconnections

1968-02-01
680795
The paper describes a method of interconnecting integrated circuits, hybrid circuits, small encapsulated circuit modules, and certain types of discrete components. It uses simple semi-automatic or completely automated processes which do not require large investment in capital and elaborate equipment. The transition from the circuit designer's interconnection diagram or wiring list to the fabricated interconnection matrix can be effected within minutes or hours instead of days or weeks. The method offers the compactness and complex interconnection capabilities of multi-layer circuit boards, but without long lead times and high cost.
Technical Paper

Postage Stamp Electronics

1968-02-01
680794
THIS PAPER DISCUSSES the various forms of hybrid circuits being fabricated at this time, and the processes and techniques used to fabricate these devices. The reader will find that there is little new or startling in the processes and techniques being used. It will be found, however, that the manner in which these processes and techniques are used is new and novel, also, the manner in which some microminiature components are being used may be considered unique. The packaging design, processes and techniques to be discussed in this paper develop into an electronics package and/or system which may be considered the step between the integrated circuit device and the much discussed, but not yet realized, large scale integrated circuit.
Technical Paper

A Bio-Engineering Approach to Crash Padding

1968-02-01
680001
The injury-reducing functions of crash padding are discussed as they relate to head impact. The bony structure of the cranial vault (above eyebrows) is strong under localized impact compared with the face. Padding used to protect the cranial vault from impact has the primary function of absorbing energy to reduce the possibility of brain damage. On the other hand, padding for facial protection has the primary function of providing uniform load distribution on the face. The pad understructure then supplies the needed energy absorbing capacity. Test procedures to measure both energy absorption and load distribution are described, and evaluation criteria are shown. Other factors that affect padding, such as temperature and cover stock material, are discussed.
Technical Paper

How Renault Uses Numerical Control for Car Body Design and Tooling

1968-02-01
680010
Drawing and 3D milling machines are supplied with a small computer acting as function generator. “Style” can immediately loft curves and mill the shape of surfaces they have conceived with good precision. Using this new method has led Renault to alter its way of designing and tooling car bodies. The technique and these alterations are described in this paper.
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